| 摘要 |
<p>PURPOSE:To prevent a recognition error caused by flaking of a film during a semiconductor-chip dicing step. CONSTITUTION:In a semiconductor chip 10, a dummy pattern 6 is provided between a dicing line 3 and a recognition area 2 including a recognition mark 1 and located near to the dicing line 3 so that the flaking of a film can be prevented during a dicing step. Consequently, the flaking of the film is prevented even when the film partly flakes during the dicing step, and thereby the recognition area can be protected from the flaking.</p> |
