| 摘要 |
PURPOSE:To prevent generation of edge short circuit due to increase of element thickness, and to improve mass productivity and increase packaging density. CONSTITUTION:In a semiconductor device, in which a semiconductor element is loaded, an element-rear end section 24, in which the end section of the rear of the semiconductor element 27 mounted on the inside is formed thinly, the semiconductor element 27, in which said element-rear end section 24 is hung and fixed to the frame-shaped die pad 30 of a frame, and a sealing resin 33 are provided. |
