发明名称 |
Semiconductor device package with solder bump electrical connections on an external surface of the package |
摘要 |
Wells are formed in an external surface of a semiconductor device package body. Capacitors are disposed within the wells at least partially, and preferably fully within the body. Cleaning channels are formed underneath the capacitors, for removing residual flux and/or solder.
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申请公布号 |
US5249098(A) |
申请公布日期 |
1993.09.28 |
申请号 |
US19920922118 |
申请日期 |
1992.07.28 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
ROSTOKER, MICHAEL D.;LEY, TOM |
分类号 |
H01L23/64;H05K1/03;H05K1/18 |
主分类号 |
H01L23/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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