发明名称 |
Semiconductor integrated circuit device with multiplayered wiring |
摘要 |
A semiconductor integrated circuit device capable of having a high integration density and excellent performance and a method of fabricating the semiconductor integrated circuit device are disclosed. In this semiconductor integrated circuit device, a connecting conductor for connecting gate wiring which is formed on a field oxide film and extended from the gate of a MOSFET, to the source/drain region of another MOSFET is interposed between the gate wiring and one of two side space layers for defining the width of the gate wiring.
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申请公布号 |
US5247198(A) |
申请公布日期 |
1993.09.21 |
申请号 |
US19890408722 |
申请日期 |
1989.09.18 |
申请人 |
HITACHI, LTD. |
发明人 |
HOMMA, HIDEO;SAITO, RYUICHI;AKIOKA, TAKASHI;KOBAYASHI, YUTAKA |
分类号 |
H01L21/768;H01L21/8238;H01L27/092 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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