发明名称 Semiconductor integrated circuit device with multiplayered wiring
摘要 A semiconductor integrated circuit device capable of having a high integration density and excellent performance and a method of fabricating the semiconductor integrated circuit device are disclosed. In this semiconductor integrated circuit device, a connecting conductor for connecting gate wiring which is formed on a field oxide film and extended from the gate of a MOSFET, to the source/drain region of another MOSFET is interposed between the gate wiring and one of two side space layers for defining the width of the gate wiring.
申请公布号 US5247198(A) 申请公布日期 1993.09.21
申请号 US19890408722 申请日期 1989.09.18
申请人 HITACHI, LTD. 发明人 HOMMA, HIDEO;SAITO, RYUICHI;AKIOKA, TAKASHI;KOBAYASHI, YUTAKA
分类号 H01L21/768;H01L21/8238;H01L27/092 主分类号 H01L21/768
代理机构 代理人
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