| 摘要 |
Hot melt adhesive based on a polyarylene ether ketone of the formula -[-O-Ar(-L-Ar)x-O-Ar-CO-(-Ar-M)y-Ar-]-(I) for which the ether/ketone ratio is between 0.5 and 2 and the melt flowability MVI (400/10 min) is 2 to 250. These hot melt adhesives facilitate adhesive bonds, which are resistant to high temperatures, at composites composed of metallic, ceramic and/or polymer substrates which have very good shear strengths.
|
