| 摘要 |
PURPOSE:To provide the structure of the title semiconductor device capable of leaving no foams at all in the sealing resin during the thremo-setting process of the sealing resin. CONSTITUTION:A dam frame 3 making an obtuse holding angle between the inner wall surface 6 thereof and a circuit substrate 5 when it is mounted on the circuit sun-strate 5 is bonded onto the circuit substrate 5 while encircling the semiconductor block 2 and then a thermo-setting low viscosity sealing resin 4 is poured into the dam frame 3 to be thermoset by heating step. |
