| 摘要 |
PURPOSE:To prevent the generation of a defective thin film body caused by the sticking of peeling pieces from a structure by constituting a structure stuck with a film other than a film forming material in a thin film forming apparatus of a material having a thermal expansion coefficient same as that of the film or similar thereto. CONSTITUTION:In a thin film forming apparatus, a structure (such as a shutter sheet, sample carrier, cathode shield and manipulator) stuck with a film other than a film forming material is constituted of a material having a thermal expansion coefficient same as that of a thin film to be formed or similar thereto. For example, a structure made of SUS is used for an Al film and a Cu film, a structure made of BN, SiC or zircon is used for an Si3N4 film and SiN amorphous, a structure made of SnO2 or In2O3 is used for an ITO film and a structure made of quartz is used for a Ta2O5 film. In this way, the generation of defective products caused by the peeling of a thin film stuck to the structure can be prevented. |
