| 摘要 |
PURPOSE:To improve the reliability of a semiconductor device by placing a lead frame with a semiconductor element attached to a substrate, by covering a cap on the above, and by sealing the penetrated section of a lead wire glass having the surface of a nonferrous metal film when the lead is led out from the lead frame above-mentioned. CONSTITUTION:While a semiconductor element 2 is positioned in the concave section of a substrate 1 of ceramic or the like with a concaved section at the center, the lead frame having the above-mentioned semiconductor element placed is arranged on a substrate 1. At this time, an element 2 and the frame have already been connected by a wire 4 and then the lead 3 of the frame is protruded toward outside and is bent downward. Then a cap 5, with a concaved section on the lower side, is placed on the substrate 1, and a sealing glass 6 with an Al film is filled on the side facing to lead 3 at the lead penetrated section between the cap 5 and the substrate 1. Hence the thermal stress between the substrate 1 and the cap 5 can be absorbed with the Al film and the span of life of the device can be extended a great deal. |
