| 摘要 |
Three-dimensional assembly of electronic components using microwires and blobs of solder, and method of producing this assembly. The assembly of electronic components of the invention includes: A) - at least one first (1) electronic component equipped on one of its faces (1a) with at least one first electrical contact terminal (5) fitted with a conducting microwire (7) oriented perpendicularly to the said face, B) - at least one second electronic component (10a, 10b, 10c) equipped on one of its faces with at least one second electrical contact terminal, the first and second electronic components being perpendicular, in contact with one another and positioned in such a way that the microwire faces the second electrical contact terminal, the microwire being connected to the second conducting terminal, via a solder element (15b). <IMAGE> |
