KERAMIKSUBSTRAT FUER ZULEITUNGEN UND VERFAHREN ZU SEINER HERSTELLUNG.,申请号DE19863688130T-传众专利搜索

发明名称	KERAMIKSUBSTRAT FUER ZULEITUNGEN UND VERFAHREN ZU SEINER HERSTELLUNG.
摘要	A ceramic wiring substrate and a process for producing the same having a conductive layer, obtained by sintering a conductive paste comprising 85 to 97% by weight of a tungsten powder and 15 to 3% by weight of a sintering additive (for conductive metal) having a specified composition, on a mullite ceramic substrate.
申请公布号	DE3688130(T2)	申请公布日期	1993.09.16
申请号	DE19863688130T	申请日期	1986.12.31
申请人	HITACHI, LTD., TOKIO/TOKYO, JP	发明人	TODA, GYOZO, HINO-SHI TOKYO, JP;KUROKI, TAKASHI, TOTSUKA-KU YOKOHAMA-SHI KANAGAWA-KEN, JP;ISHIHARA, SHOUSAKU, CHIGASAKI-SHI KANAGAWA-KEN, JP;FUJITA, TSUYOSHI, TOTSUKA-KU,YOKOHAMA-SHIKANAGAWA-KEN, JP;KANDA, NAOYA, YOKOHAMA-SHI KANAGAWA-KEN, JP
分类号	H01B5/14;H01B1/16;H01B13/00;H01L21/48;H01L23/15;H05K1/03;H05K1/09;H05K3/00;H05K3/38;(IPC1-7):H01L23/14;C04B41/51;H01L23/48	主分类号	H01B5/14
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