Semiconductor mounting eg for GaP LED - supports chip on raised surface of carrier with intermediate metallised silicon chip of similar thermal expansion coefficient

摘要

The module is secured on a support (10.1). The chip and its securing layer are fastened on a section raised w.r.t. its surroundings. The raised section (11) has a face corresp. to the semiconductor chip surface. On the support is pref. secured an intermediate member (12) of a material whose expansion coefft. corresp. to that of the chip (11). The intermediate member may be secured in a depression in the surface of the support. The intermediate member is typically a silicon chip metallised on both sides. ADVANTAGE - Small mechanical stress on semiconductor chip. Increased life of LED.