首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
WAFER POLISHING DEVICE
摘要
申请公布号
JPH05234969(A)
申请公布日期
1993.09.10
申请号
JP19920039218
申请日期
1992.02.26
申请人
HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD
发明人
ASADA TAKAO;NANBA YUKIO
分类号
B24B7/22;H01L21/304;(IPC1-7):H01L21/304
主分类号
B24B7/22
代理机构
代理人
主权项
地址
您可能感兴趣的专利
SUBSTITUTED PROPANOLAMINE AND MORPHOLINE DERIVATIVES
Process for the preparation of beta-hydroxy-alpha-amino-carboxylic acids.
Reciprocating pistons internal combustion engine.
MODIFIED MONO-AZO DISPERSION DYE AND PROCESS FOR PREPARING THE SAME
TECHNOLOGY FOR RECOVERING POOR WOLFRAM ORES
LIGHT-SENSITIVE RELAY
1,1'-OXY-BIS-(4N-BENZAMIDO)-BENZENE DERIVATIVES AND PROCESS FOR PREPARING THE SAME
PROCESS FOR HIGH PRESSURE ETHYLENE POLYMERIZATION
APPARATUS FOR CHECKING THE BOTTOMING VOLTAGE IN PIT LAMPS
ELECTRONIC FLOW METER FOR LOW FLOW RATES
INSTALLATION FOR LUBRICATING CIRCULAR KNITTING MACHINES
EFFECT TEXTILE YARN AND PROCESS FOR SPINNING THE SAME
SAW BLADE
Method and arrangement for operating convertor-fed rotary current drives for vehicles
PROCESS FOR THE PREPARATION OF 2-PENEM
ANLAEG TIL AUTOMATISK STYRING, OVERVAAGNING OG AFPROEVNING AF ELEKTRISKE OG MEKANISKE APPARATER I AUTOMOBILER
AERATOR
BLANDINGSVENTIL TIL BRUGSVAND
Improved plane surface sealing by means of pressure compensation in rotary piston machines
Sight for a bombardment-proof protective helmet
