| 摘要 |
PURPOSE:To provide a photosensitive resin compound with which a relief pattern of a film thickness having a film strength, heat resistance, and adhesiveness can be formed by specifying polyimide including repetitive unit. CONSTITUTION:A photosensitive resin compound contains polyimide including repetitive unit given by the structural formula as shown in the figure, to which a photo-starting agent and organic solvent are added according to necessity. In the formula, X is mono-valent organic group having a radical polymerized or doubled by light, R1 is four-valent organic group, R2 is (2+P) valent organic group, R3 is two-valent organic group, P is integer between 1 and 4, and n/m is mol ratio between 1/99 and 100/0. Such polyimide including the repetitive unit as given by the formula is formed from tetracarbonic acid di-anhydride, diamine including hydroxyl radical, other diamines according to necessity, and isocyanate compound having a radical which is polymerized or doubled by light. |
