| 摘要 |
<p>PURPOSE:To obtain a method for mounting a board of a surface mounting type package in which a connecting malfunction can be prevented even if flatness of outer leads is improper. CONSTITUTION:A surface mounting type package 1 is mounted on a printed board 3. The board 3 and the package 1 are covered with an insulation film 5, vacuum-sealed, and outer leads 2 of the package 1 are connected in close contact with mounting pads 4 of the board 3.</p> |
