| 摘要 |
PURPOSE:To manufacture a high density printed board having a laminated fine wiring pattern circuit in a building-up system by improving adhesive properties between interlayer insulating films and the insulating film with a conducting circuit pattern. CONSTITUTION:An interlayer insulating film 3 of heat resistant resin in which filler is previously dispersed is printed on a surface of a printed board l. A land 2a of a conducting circuit pattern 2 is opened, the film 3 is patterned, and catalyst 6 is applied. A surface of the film 3 except a part to be laminated and formed with the pattern is polished to remove the catalyst. The filler of at least a surface layer of the insulating film is dissolved to be removed, and nickel plating 9 and copper plating 7 are formed for a conducting circuit pattern. Then, the steps are repeated in number corresponding to the number of laminated layers. |
