CIRCUIT DEVICE MOUNTING SEMICONDUCTOR

摘要

PURPOSE:To provide a circuit device mounting semiconductor which is excellent in thermal stress resistance and can be fully protected against fracture generated at a bump section and easily repaired without heating (reflow). CONSTITUTION:A wiring board 1 provided with a required terminal electrode on its surface and a semiconductor chip 2 which is electrically connected to the terminal electrode of the wiring board 1 through the intermediary of bumps 3 and mounted on the board 1 in a face-down bonding manner are provided, the wiring board and a semiconductor chip are connected together through the bumps 3 fitted into each other with reaction attendant on the deformation of the bumps 3 in an elastic range at fitting.