| 摘要 |
PURPOSE:To provide a semiconductor device wherein a plurality of semiconductor elements can be mounted efficiently at the inside. CONSTITUTION:A film 5c for insulation use is pasted on the surface of inner leads 1a, 1c; a film 5d for insulation use is pasted on their rear surface; a film 5a for insulation use is pasted on the surface of inner leads 1b, 1d; a film 5b for insulation use is pasted on their rear surface; a semiconductor element 3b is bonded to the upper part of the films 5a, 5c for insulation use; a semiconductor element 3a is bonded to the lower part of the films 5b, 5d for insulation use. The semiconductor elements 3a, 3b and the inner leads 1a to 1d are wire- bonded by means of gold wires 4; this assembly is sealed with a molding resin 2. |
