| 摘要 |
PURPOSE:To provide a resin-sealed semiconductor device, wherein a partial region only including the bonding areas of lead frames and a semiconductor element has a resin-sealed structure and which is superior in heat dissipation property and is low in cost. CONSTITUTION:A semiconductor element 1 is bonded to a heat dissipation plate 2 via die bonding member 3 and lead frames 15 are bonded to the plate 2 via insulating members 4. Each end of inner leads of a plurality of the lead frames 15 bonded to the members 4 is connected to the element 1 via bonding wires 6. A partial region including the element 1 arranged on this plate 2, the wires 6 and each one part of the inner leads of the frames 15 is sealed with a molding resin 7. Heat which is generated in the element 1 is effectively dissiapted outside of a resin-sealed semiconductor device through the plate 2 and the exposed surfaces of the frames 15. |
