发明名称 EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
摘要 PURPOSE:To get an epoxy resin composition for sealing an optical semiconductor, which is excellent in transparency, heat resistance, and is small in stress to a sealed element by making it contains the three ingredients of epoxy resin, anhydride, anhydride, and polyurethane elastomer. CONSTITUTION:As epoxy resin, there is no special restriction so long as it is a thing free of coloring. It is to be desired that an anhydride should be an object which works as the hardener of the epoxy resin and has alicyclic acid anhydride for its main ingredients so as to secure optical property. For example, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 3 or 4 methylhexahydrophthalic anhydride, etc., can be cited, and these are used singly or in combination. As polyurethane elastomer, there is no special restriction so long as it is a thermoplastic polyurethane elastomer. It is suitable to put the quantity of used polyurethane elastomer at 5-50wt.% of the total quantity of the epoxy resin, anhydride, and polyurethane elastomer.
申请公布号 JPH05226702(A) 申请公布日期 1993.09.03
申请号 JP19920028046 申请日期 1992.02.14
申请人 HITACHI CHEM CO LTD 发明人 TSUCHIDA SATORU;HIROKAWA KOZO;KOSAKA MASAHIKO
分类号 C08G59/42;C08G59/00;C08L63/00;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G59/42
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