| 摘要 |
<p>PURPOSE:To ball-up a wire without using an excellent chip even when there is disconnections of wire, etc., when a ball bump is formed by ball-bump bonding on the electrode on a semiconductor chip. CONSTITUTION:When a device stops by the error such as disconnection of wire and the like when automatic ball bump bonding operation is conducted, a bonding head 13 is shifted to a waste bonding stage 1 from a wafer stage 11 by a switching operation, a wire is pressed and cut using the waste bonding stage 1, and a ball is formed at the tip of the wire by electric discharge. Then, the bonding head is returned to the automatic bonding.</p> |
