Heat-resistant adhesive composition.

摘要

The present invention provides a heat-resistant adhesive composition comprising mainly 1) a polycarbodiimide resin and an epoxy resin, or 2) a polycarbodiimide resin, an epoxy resin and a curing agent for the polycarbodiimide resin, or 3) a polycarbodiimide resin, an epoxy resin and a curing agent for the epoxy resin. Said heat-resistant adhesive composition can be applied under mild conditions, has excellent heat resistance and chemical resistance, and is superior in adhesion strength particularly at high temperatures.