发明名称 RESIN COMPOUND COATING DEVICE OF RESIN COMPOSITION USING SAID DEVICE
摘要 PURPOSE:To control the coating amount of a resin compound, to uniformize coating thickness from a central part to an end part and to also prevent the cutting of a coating layer by applying the resin compound to a rotary shaft and scraping off the coated resin compound by a scraper to apply the same to an object to be coated. CONSTITUTION:A resin compound 2 is transferred to a resin compound coating device by a transfer means such as a pump and the transferred resin compound is applied to a rotary shaft 5 at first by a doctor blade 4 and subsequently scraped off by a scraper 7 to be applied to the gap between two glass fiber layers 6. The coating amount of the resin compound 2 can be appropriately controlled by adjusting the number of rotations of the rotary shaft and the gap width of the doctor blade.
申请公布号 JPH05220436(A) 申请公布日期 1993.08.31
申请号 JP19920028149 申请日期 1992.02.14
申请人 DAINIPPON INK & CHEM INC 发明人 OGASAWARA YOSHIYA;MIHATA ICHIRO
分类号 B05C5/00;B05D7/02;B29C70/06;B29K105/08;B29L7/00 主分类号 B05C5/00
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