| 摘要 |
<p>1. A semiconductor component having a semiconductor body, which is surrounded by a casing which essentially exhibits insulating properties and consists, at least in part, of a synthetic resin casting or moulding material, characterised in that in the regions of the surfaces of the semiconductor body at which pn-junctions occur, the casing consists of a combination of three layers ; that the first layer (5) is amorphous silicon containing oxygen ; that on this layer there is applied an elastic covering layer forming the second layer (6) ; that the synthetic resin casting or moulding material is provided as the third layer (7) ; and that the modulus of elasticity of the covering layer is smaller than that of the semiconductor body and that of the synthetic resin material.</p> |
