发明名称 CIRCUIT SUBSTRATE
摘要 PURPOSE:To prevent paste from overflowing to an adjacent pattern even if a plurality of electric elements are bonded adjacent to each other by applying the paste on the pattern. CONSTITUTION:In a circuit substrate 1, paste 4 is applied onto a pattern 3 which is arranged adjacent to each other on a substrate 2 corresponding to each position of a plurality of electric elements 5 arranged adjacent to each other and a plurality of electric elements 5 are bonded on the paste 4. A wall 8 which is not thinner than the pattern 3 is provided on the substrate 2 excepting the pattern 3.
申请公布号 JPH05218503(A) 申请公布日期 1993.08.27
申请号 JP19920016976 申请日期 1992.01.31
申请人 TOSHIBA LIGHTING & TECHNOL CORP;TOSHIBA AVE CORP 发明人 MATSUNAGA KIYOSHI
分类号 H01L21/52;H01L33/62;H05K3/32;H05K3/34 主分类号 H01L21/52
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