| 摘要 |
<p>PURPOSE:To improve the heat dissipating property of a circuit board by forming a first conductive layer onto a metallic base material through a first insulating layer, and sticking a second insulating layer and a second conductive layer at the same time onto the first conductive layer. CONSTITUTION:A first insulating layer 12 is made on a heat well conductive metallic base material 11, and first conductive layers 24 and 34 are made on this first insulating layer 12. Next, resin is applied between the patterns of these conductive layers 24 and 34 and on the edge 19 of the substrate 11 so as to remove the difference in level on the surface. This way, it is put in the condition that there is practically no difference in level, and a second insulating layer 20 and a second conductive layer 13 are made thereon. In that case, the second insulating layer 20 and the second conductive layer 13 are made in advance on the second insulating layer 20, and it is stuck onto the first conductive layers 23 and 34. Hereby, the heat dissipating property of the circuit board can be improved.</p> |
