| 摘要 |
PURPOSE:To improve the semiconductor cooling ability of a semiconductor container by integrally forming a fan with the container. CONSTITUTION:A semiconductor chip 2 is mounted on the bottom of a housing container section 1. The chip 2 is electrically connected with input-output pins by wire bonding. Since the lid section 4 for enclosing the upper opening of the section 1 is integrally formed with a cooling fan 3, the chip 2 can be cooled by the fan 3. The operating power of the fan 3 is supplied to the fan 3 through the input-output pins and inside of the container 1. Therefore, the chip 2 cooling ability of the section 1 can be improved as compared with the case where only a fin is used. |
