| 摘要 |
PURPOSE:To obtain a semiconductor device and its manufacturing method which device can correspond with the packaging of semiconductor pellets different in size by using one lead frame. CONSTITUTION:A bed 23 arranged on a lead frame 24 is formed so as to protrude upward from inner leads 22, and the size of the bed 23 is made smaller than a semiconductor pellet 25. Hence the inner leads 22 can not come into contact with the semiconductor pellet 25, and the length of a metal thin wire 28 can be suitably set. When the semiconductor pellet 25 is fixed on the protruding bed 23, or the metal thin wire 28 is connected with the pellet 25, suspension pins are elastically deformed, and the inner leads 22 and the bed 23 form the same plane. After connection, the deformation is elastically recovered, so that each processing is faciliated. |
