THERMAL STRESS-RELIEVED COMPOSITE MICROELECTRONIC DEVICE

摘要

A microelectronic package comprising a rigid substrate (1) having mounted thereon a component (3) having a plurality of sides and an electrically functional layer (9) adjacent to at least two sides of the component (3), the component (3) and the electrically functional layer (9) being spatially separated by a guard band (7), the volume of the substrate (1) underlying the guard band (7) having at least one region (13d) of reduced rigidity which permits the substrate (1) to dissipate mechanical stresses generated therein when the device is subjected to heating.