发明名称 PHOTOCOUPLING SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To improve the insulating strength of a transparent insulating resin in a photocoupling semiconductor device without lowering the photocoupling sensitivity by providing an intermediate layer with opaque insulating resin having large adhering strength with the transparent insulating resin therein. CONSTITUTION:There are coated opaque insulating resin becoming no surface electrically in the boundary with a transparent insulating resin layer 7 on the surface of the layer 7 as well as on the input side external lead conductors 2a, 2b, output side external lead conductors 5a, 5b, input side internal lead wire 3 and output side internal lead wire 6 on the required surface to form an intermediate opaque insulating resin layer 9 thereon.</p>
申请公布号 JPS55163883(A) 申请公布日期 1980.12.20
申请号 JP19790072917 申请日期 1979.06.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 KITABI SHIGERU
分类号 H01L23/29;H01L23/31;H01L31/12;H01L31/16;H01L33/54;H01L33/56 主分类号 H01L23/29
代理机构 代理人
主权项
地址