| 摘要 |
PURPOSE: To enable simultaneous manufacture of a multi-layered thin-film interconnection structure and a ceramic substrate with a good yield by forming on a transmitting substrate a separation layer which is less formed, when reacted with a predetermined electromagnetic radiation. CONSTITUTION: A polymer layer 2 is cut off by applying an ultraviolet light 10 from a scanning layer, via a transmitting substrate 1 to the polymer layer 2. Since a metallic layer 3 acts as a reflecting layer, the ultraviolet light 10 cannot reach an interconnection structure 4. As a result of the laser cut-off, monomer pieces, that is, an emitted substance gas is trapped between the substrate 1 and reflecting metal layer 3, thus forming voids 15 within the polymer layer 2. The polymer layer 2 is formed less due to the voids 15, and thus can be separated (removed) from the substrate 1. After the structure 4 has been removed from the substrate 1, the structure 4 is supported by a metal ring (frame) 5. At this time point, the structure can be applied to an electrically good glass ceramic substrate. |
