| 摘要 |
PURPOSE:To obtain a solder crack as an evaluating data having little dispersion while observing an internal crack in a nondestructive manner by irradiating a semiconductor package with soft X-rays and inspecting the internal crack of the package in the nondestructive manner. CONSTITUTION:A semiconductor package is prepared by using an epoxy semiconductor sealing medium, moisture is absorbed for a prolonged term at a high temperature under high humidity, an internal crack surface 3 is irradiated with soft-X-rays from an upper section in the solder-treated semiconductor package 1, and a transmitted X-ray image 5 is image-sensed on a film 4 in a lower section. A distance 7 up to the outside of the package toward the direction of generation from a position, where a crack is generated, is represented by (8), and the transmitted X-ray image is evaluated by 0: no crack, (1): crack length of 1/2a or less, (2): crack length of 1/2a or more, (3): quantification by a point as an external crack, etc. Since the internal crack is observed by soft X-rays, the observation method of the internal crack can be carried out simply, and the package can be evaluated by nondestructive inspection. |
