PIN-GRID ARRAYS

摘要

A heat sink (10) adapted to be attached to a pin grid array (30) comprising a pair of grooves (14, 16) extending along opposite sides into which grooves the tops of attachment clips (40) are disposed, a pair of indentations (48, 50) on opposite sides of each clip holds each clip in place in the groove, the heat sink with the clips attached being positioned between two compression sections of a pair of attachment pliers (60) and when a pin grid array is positioned adjacent to the heat sink, compression of the plier handles (62, 64) connects the clips to the pin grid array. Removal is accomplished by a pair of pliers having projecting points which fit beneath the clips so that compression of the plier handles forces the clip away from the pin grid array disconnecting it.