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发明名称
MANUFACTURING METHOD OF CONNECTION STRUCTURE BETWEEN TWO CONDUCTIVE LAYERS IN SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH05206280(A)
申请公布日期
1993.08.13
申请号
JP19920013145
申请日期
1992.01.28
申请人
MITSUBISHI ELECTRIC CORP
发明人
FUJIKI AKIMASA;HARADA SHIGERU
分类号
H01L21/768
主分类号
H01L21/768
代理机构
代理人
主权项
地址
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