发明名称 MOLDING RESIN FOR PHOTO-SEMICONDUCTOR
摘要 PURPOSE:To radiate the title molding resin not to cause a loss in the quality of externally radiated light while enhancing the diffusion effect by taking an optically indefinite shape by a method wherein the scaled shape is given to a glass material which is mixed with the resin member as a light diffusion member. CONSTITUTION:A transparent scaled glass material in particle diameter not exceeding 1000 micron as a light-diffusing material 1 is mixed with a translucent epoxy resin. Besides, respective particle diameters are actually 50-1000 micron while the member is formed of a transparent glass material taking a scaled shape. On the other hand, the outer diameter takes an arbitrary scaled shape such as circular, quadrilateral, triangle, etc., furthermore, both surfaces thereof are formed of concave and convex surfaces as if taking a glasses lens shape. At this time, the higher the diffusion effect, the more the difference between the refractive index of the glass member forming the light-diffusing material and that of the epoxy resin, etc., to be a case material. Finally, the transparent epoxy resin 2 and the light-diffusing material 1 are mixed with each other at high mixing ratio to be vacuum-defoamed after the mixture is satisfactorily agitated.
申请公布号 JPH05206524(A) 申请公布日期 1993.08.13
申请号 JP19920248809 申请日期 1992.08.25
申请人 STANLEY ELECTRIC CO LTD 发明人 TAMURA HIROMOTO
分类号 G02B5/02;H01L23/29;H01L23/31;H01L33/56;H01L33/58 主分类号 G02B5/02
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