| 摘要 |
<p>A low-profile, clip-on heat sink (1) for computer chip packages that releasably engages the side of the package and method for cooling computer chips is disclosed. The sink (1) comprises a contact pad (4) attached to a set of beams (8). Flanges (10) extend down from the outer edges of the beams (8). The sink (1) is engaged to the package by the flanges (10) which attach to the sides of the package. When the sink (1) is engaged to the package, the contact pad (4) contacts the computer chip. When the chip is operating, heat flows from the chip to the contact pad (4). Heat then flows from the contact pad (4) to the beams (8) where it dissipates into the ambient surroundings. The sink (1) may be released from engagement by deforming the flanges (10). <IMAGE></p> |
