| 摘要 |
A light emitting diode print head has an aluminum substrate or mother plate. A plurality of stainless steel tiles are assembled in a row on the substrate. Each of the tiles has a row of dice, each of which has a row of light emitting diodes. The tiles are assembled so that the LEDs are in a row extending across the print head with the adjacent LEDs at the edges of each of tile being a short distance apart. Compensation for differences in coefficient of thermal expansion between the tiles and substrate is provided by a pair of stainless steel strips adhesively bonded between the tiles and substrate. Each strip is bonded along an edge of the row of tiles away from the row of LEDs by a compliant adhesive. A thermally conductive compliant adhesive is provided between the tiles and substrate beneath the LEDs for heat transfer. The stainless steel strips serve as compensation for the difference in coefficient of thermal expansion between the tiles and substrate. There is a yield increase in print heads of at least 10% without any significant cost increase.
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