发明名称 MANUFACTURE OF SEALING PLATE USING FILM-CLAD MATERIAL
摘要 <p>PURPOSE:To eliminate the generation of punching powder out of a laminate end face and prevent the mixing of the same into a capacitor by punch cutting a film-clad laminate into proper size by a sealing plate of electrolytic capacitor or the like and then rubber molding the whole except one side film face. CONSTITUTION:Eight pieces of prepregs formed by a paper base impregnated and coated with phenol varnish and dried are laminated, and further polyetherimide films of approximately 50mum thickness are laminated on both sides, and laminate molding is carried out, for example, at the temperature of 160 deg.C and under the pressure of 100kgs/cm<2> for approximately 95 minutes to manufacture a surface film-clad laminate of approximately 1.6mm thickness. Said film-clad laminate is cut into, for example, the size of 25mm, and then an ethylene propylene bar is rubber molded into approximately 0.7mm thickness to constitute a desired sealing plate. Thus the selaing plate without the generation of punching power out of the end face of laminate is manufactured, and the mixing of punching powder into a capacitor is prevented securely.</p>
申请公布号 JPH05200896(A) 申请公布日期 1993.08.10
申请号 JP19910329161 申请日期 1991.12.12
申请人 SUMITOMO BAKELITE CO LTD 发明人 YAGI SHIGEYUKI;SEKI TOSHIYUKI
分类号 B32B37/00;B29K21/00;B29K105/06;B32B3/02;B32B25/08;H01G9/10 主分类号 B32B37/00
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