| 摘要 |
<p>PURPOSE:To prevent flow and deformation of bonding wires in molding despite of long bonding wires by providing a supporter for bonding wires and grooves for fixing the bonding wires in the grooves. CONSTITUTION:A supporter 18 is provided for supporting Au wires 16a to 16p. Grooves for fixing the Au wires 16a to 16p in the grooves are formed. As a result, flow of Au wires 16a to 16p caused by the pressure of flowing resin can be prevented in molding by resin. In addition, short circuit between a die stage 12 and the Au wires 16a to 16p can be prevented, and short circuit between Au wires 16a to 16p can be also prevented.</p> |
