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发明名称
PACKAGING STRUCTURE OF SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH05198740(A)
申请公布日期
1993.08.06
申请号
JP19920030065
申请日期
1992.01.21
申请人
MITSUBISHI MATERIALS CORP
发明人
TOYODA SEIJI;NAGASE TOSHIYUKI;KUROMITSU YOSHIO;YOSHIDA HIDEAKI
分类号
H01L23/12;H01L21/48;H01L23/15;H01L27/01
主分类号
H01L23/12
代理机构
代理人
主权项
地址
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