发明名称 IC CHIP MOUNTING STRUCTURE
摘要 PURPOSE:To provide IC chip mounting structure which allows electrical connection of a fine IC chip provided with many pad terminals with a complicated various types of wiring boards and allows downsizing and reliability of the mounting area which includes the IC chip and the wiring part. CONSTITUTION:A plurality of the connecting pad electrodes 13 of the same IC chip 12 are connected with a plurality of terminals 14 on a plurality of different wiring boards 10 and 11.
申请公布号 JPH05198603(A) 申请公布日期 1993.08.06
申请号 JP19920008561 申请日期 1992.01.21
申请人 FUJITSU LTD 发明人 KAWADA TOYOSHI
分类号 H01L21/52;H01L21/60;H01L25/16 主分类号 H01L21/52
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