发明名称 |
ELECTRONIC COMPONENT MOUNTING APPARATUS |
摘要 |
PURPOSE:To provide an apparatus wherein the resolution of the up-and-down drive of a suction nozzle used to mount an electronic component is made high only in a required range, the resolution is made coarse in ranges other than the required range and an operating tact is made fast. CONSTITUTION:A component mounting apparatus is composed of the following: a head which sucks and mounts a component; an X-Y table which can position the head freely; and a conveyance rail which carries in, carries out and holds an electronic circuit board. The component mounting apparatus is constituted of the following: a nozzle 6 which sucks the component; a link lever 17; a motor 20 which turns the link lever 17; and a link bar 16 which connects the nozzle 6 to the link lever 17. |
申请公布号 |
JPH05198984(A) |
申请公布日期 |
1993.08.06 |
申请号 |
JP19920008927 |
申请日期 |
1992.01.22 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
OKUDA OSAMU;YAMAMOTO MINORU;HIRAI WATARU;MORIMOTO SHINJI |
分类号 |
B23P21/00;G01B11/00;H04N5/225;H05K13/04;H05K13/08 |
主分类号 |
B23P21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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