发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 PURPOSE:To provide an apparatus wherein the resolution of the up-and-down drive of a suction nozzle used to mount an electronic component is made high only in a required range, the resolution is made coarse in ranges other than the required range and an operating tact is made fast. CONSTITUTION:A component mounting apparatus is composed of the following: a head which sucks and mounts a component; an X-Y table which can position the head freely; and a conveyance rail which carries in, carries out and holds an electronic circuit board. The component mounting apparatus is constituted of the following: a nozzle 6 which sucks the component; a link lever 17; a motor 20 which turns the link lever 17; and a link bar 16 which connects the nozzle 6 to the link lever 17.
申请公布号 JPH05198984(A) 申请公布日期 1993.08.06
申请号 JP19920008927 申请日期 1992.01.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OKUDA OSAMU;YAMAMOTO MINORU;HIRAI WATARU;MORIMOTO SHINJI
分类号 B23P21/00;G01B11/00;H04N5/225;H05K13/04;H05K13/08 主分类号 B23P21/00
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