发明名称 RESIN MOLDING DEVICE FOR ELECTRONIC PART
摘要 PURPOSE:To securely confirm a wire of a diode mounted on a bottom force with a high efficiency when said wire is off from a wire fitting channel of the bottom force. CONSTITUTION:A sensor forming a proximity switch is installed on a bottom force 41. When the distance between parting line faces of both molds 41 and 42 is 0.1mm or less at the time of mold clamping, the sensor is closed. When the parting line faces of both molds 41 and 42 are as close as 1mm, the bottom force 41 is lifted up by a motorized direct drive motor 32 to measure the time until the sensor is closed. In the case said time is within 1 second, the molding is carried out continuously as it is. In the case the sensor is not closed after 1 second, a wire is judged to be off from a wire fitting channel and molding is discontinued. The leakage of resin occurred in a space between the parting line faces can be prevented by said arrangement to protect the mold.
申请公布号 JPH05192959(A) 申请公布日期 1993.08.03
申请号 JP19920006983 申请日期 1992.01.18
申请人 MITSUBISHI MATERIALS CORP 发明人 MARUYAMA MASAKI;KANDA KATSUTOSHI
分类号 B29C33/12;B29C33/22;B29C45/14;B29C45/26;B29C45/64;B29C45/76;B29K105/20;B29L31/34;H01L21/56 主分类号 B29C33/12
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