Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications

摘要

A ceramic-filled thermally-conductive composite for use in microelectronic applications includes a substantially homogeneous mixture of a solidified polymeric material and an adamantine-structured ceramic filler, such as aluminum nitride or boron nitride, wherein the solidified polymeric material is substantially continuous. The solidified polymeric material may be a material containing a predominant amount of a fusible semi-crystalline polyamide having a melting point of greater than about 250 DEG C. or a polybenzocyclobutene.