| 摘要 |
PURPOSE:To reduce the number of reflection operations or transmission operations by one operation by a method wherein an alignment mark on a substrate is irradiated with a beam of light via a projection optical system which is composed of a reflection and refraction optical system and a beam of light from the alignment mark is detected in a first direction via a light-path splitting member only by one operation. CONSTITUTION:A pattern region on a mask 4 is irradiated with a beam of exposure light IL from an optical system 22 for exposure after the beam has been transmitted through a dichroic mirror 3A. The beam of exposure light IL which has been transmitted through the mask 4 is incident on a concave reflecting mirror 9 via a first lens group 6, a half mirror 7 and a correction lens group 8. The beam of exposure light which has been reflected by the concave reflecting mirror 9 is directed again toward the half mirror 7 via the correction lens group 8; the beam of exposure light reflected by the semitransmissive mirror 7 is condensed finally on a wafer 11 by using a second lens group 10. Consequently, the image of a circuit pattern on the mask 4 is transferred onto the wafer 11 by using a projection object lens composed of a reflection and refraction optical system. |
