| 摘要 |
PURPOSE:To improve the strength of solder joints of lead terminals and thin devices. CONSTITUTION:On the surface of a substrate 4, formed are a recess 5 for housing the body 2 of a package and grooves 6 for housing lead terminals 3. The conductor pattern is extended into the grooves 6. Thus, the electronic part 1 is mounted on the substrate 4 with its body 2 and lead terminals 3 housed in the recess 5 and the grooves 6, respectively. |
