| 摘要 |
PURPOSE:To enhance component mounting density on a printed board by a method wherein a transfer chute is moved at higher speed and a backup pin is installed adjacent to the chute at the change of transfer chute in arrangement. CONSTITUTION:Transfer chutes 4 and 5 are set level with a printed board transfer level of an upstream side and a downstream side device, a table 21 movable in the direction of Y and the chutes 4 and 5 are kept distant from each other, a CPU drives an arrangement changing motor 33 to operate so as to deal with a designated board to rotate a screw shaft 37 to enable the transfer chute 4 to move against the other transfer chute 5. After the chute 4 is moved, boards different in width are sent to the chutes 4 and 5 from an upstream device, and then a cylinder 29 is actuated by an instruction outputted from a CPU to enable the chutes 4 and 5 to descend. |
