| 摘要 |
PURPOSE:To provide a method of assembling a semiconductor device which can be easily mounted even if it is mounted with passive components and other components such as a package IC and the like. CONSTITUTION:A first process where a protrudent two-stepped bump 5 is formed on an Al electrode 2 of a semiconductor device 1, a second process where cream solder 7 formed of particles 5mum or below in grain diameter is transferred onto the bump 5, a third process where a semiconductor device 1 is mounted on electrodes 9 provided onto a circuit board 8 corresponding to the electrodes 2 of the device 1, and a fourth process where the cream solder 7 is fused again are provided. |
