| 摘要 |
<p>A fluorosilicone pressure sensitive adhesive (PSA) having high solvent resistance is disclosed. The PSA is formed of (A) from about 5 to 70 percent fluorosilicone polymers; (B) from about 10 to 60 percent of a silanol containing MQ resin; and (C) from about 10 to 50 percent of resin compatible diorganosiloxane polymers and may be diluted and cured in the presence of a catalyst or initiator. <IMAGE></p> |
