发明名称 MOLD APPARATUS FOR MOLDING RESIN SEAL PART FOR ELECTRONIC PART
摘要 PURPOSE:To eliminate an ejector pin for a product on the top mold side and even so, to make a molded resin seal part not to adhere on the top mold side when the mold is opened. CONSTITUTION:The second runner is provided besides the first runner communicating with a mold cavity 28 through a gate 25. The second runner is in parallel with the first runner 24 and is along the arrangement of a number of mold cavities 28 and is positioned on the opposite side of the gate 25. Both runners are faced to wire-fitting channels 29 and 30 from the top mold 11 side. The first runner ejector pin 57 and the second runner ejector pin 79 are provided each to the first runner 24 and the second runner. Therefore, when the mold is opened, the runner ejector pins 57 and 79 eject respectively solidified resins 77 and 78 in both runners. These resins 77 and 78 eject respectively both wires 3 of each diode 1. A resin seal part 4 is surely separated thereby from the top mold.
申请公布号 JPH05185456(A) 申请公布日期 1993.07.27
申请号 JP19920003359 申请日期 1992.01.10
申请人 MITSUBISHI MATERIALS CORP 发明人 OBARA MITSUHIRO
分类号 B29C45/02;B29C45/14;B29C45/26;B29C45/40;B29K105/20;B29L31/34;H01L21/56 主分类号 B29C45/02
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