| 摘要 |
PURPOSE: To provide a method of bonding a nickel-titanium (nitinol) without losing its shape memorizing characteristics and superelastic characteristics. CONSTITUTION: As to a bonding method in this invention, for removing contaminants from the surface of nitinol, a flux is heated to an activation temp., and the contaminants are allowed to suspend in the flux. The flux suspending the contaminants and titanium taken out from the surface of nitinol therein minimizes the oxidation of a nickel-rich interface surface. Next, this flux is cooled to form a flux individual coating. After that, the flux is removed, and the contaminants and titanium are removed from its surface. Moreover, a tin-silver solder material is flowed onto the nickel-rich interface surface to remove the flux. A molten solder material having an annealing temp. equal to or below the m.p. of nitinol is arranged on the nickel-rich interface surface, another metal is brought into contact with this molten solder material, the solder material is cooled, and nitinol is bonded to the metal. |
